Hot swap condensor for immersion cooling
AssigneeLiquidstack Holding B.V.
InventorKar-Wing Lau
Life of this patent
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Abstract
A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing device removably locatable in the first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable and an apparatus coupled to the condensing device for selectively adjusting a height and/or a location of the condensing device about the first opening of the immersion cooling tank.
Claims27
A device for hot swapping at least one electronic device from an immersion cooling tank having a first opening, the device comprising:
- a condensing device, removably locatable in the first opening of the immersion cooling tank, the condensing device comprising a condensing coil forming a second opening through which the at least one electronic device is removable;
- and
- an apparatus coupled to the condensing device for selectively adjusting at least one of a height and a location of the condensing device about the first opening of the immersion cooling tank.
A method of hot swapping at least one electronic device from an immersion cooling tank having a first opening, the method comprising:
- providing a condensing device comprising a condensing coil forming a second opening;
- providing an apparatus coupled to the condensing device;
- using the apparatus to selectively adjust a height and a location of the condensing device about the first opening of the immersion cooling tank;
- inserting an item lock into the immersion cooling tank through the second opening;
- and
- removing, with the item lock, the at least one electronic device from the immersion cooling tank via the second opening.
Dependencies are inferred from the claim text.