Back to results
US 11,155,085 B2Granted
Thermal fluid ejection heating element
AssigneeHewlett-Packard Development Company, L.P.
InventorsStanley J Wang, Erik D Torniainen, Vincent C Korthuis
Life of this patent
Estimating the term…
Abstract
A thermal fluid ejection heating element may include a first conductive trace, and an at least partially perforated resistive thin film material electrically coupling the first conductive trace to a second conductive trace. The perforations within the perforated resistive thin film material defines a resistance of the thermal fluid ejection heating element.
Claims20
A thermal fluid ejection heating element, comprising:
- a first conductive trace;
- and
- an at least partially perforated resistive thin film material electrically coupling the first conductive trace to a second conductive trace,
- wherein:
- the at least partially perforated resistive thin film is divided into individual resistive sub-elements arranged to cascade in failure;
- and
- perforations within the perforated resistive thin film material:
- are in a symmetrical lattice pattern across the resistive thin film material;
- and
- define a resistance of the thermal fluid ejection heating element.
7 more elements
A fluid ejection device comprising:
- a number of fluid ejection chambers;
- and
- a number of thin-film resistive elements disposed within each of the fluid ejection chambers, the resistive elements comprising:
- an at least partially perforated resistive thin film material electrically coupling a first trace to a second trace,
- wherein:
- the at least partially perforated resistive thin film is divided into individual resistive sub-elements arranged to cascade in failure;
- and
- perforations within the perforated resistive thin film material:
- are homogenously spaced across the resistive thin film material in evenly spaced offset rows in perforated portions of the at least partially perforated resistive thin film;
- and
- define a resistance of the thin-film resistive elements.
8 more elements
A resistor comprising:
- a thin-film resistive material electrically coupling a first trace to a second trace;
- and
- a number of perforations defined in the thin film resistive material, the perforations defining a resistance of the resistor, wherein the perforations:
- define a number of resistive sub-elements in series and parallel,
- are homogenously spaced across the resistive thin-film resistive material in evenly spaced offset rows in perforated portions of the at least partially perforated resistive thin film, and
- form a resistance gradient across a height and width of the thin-film resistive material;
- and
- wherein, in response to an open circuit failure of a sub-element, the resistive sub-elements are arranged to cascade in failure along a row at an angle relative to the evenly spaced offset rows.
5 more elements
Dependencies are inferred from the claim text.