Thermal management assemblies for electronic assemblies mounted on a motor end

An electronic assembly comprising:

• a printed circuit board having a first surface and a second surface opposite to the first surface, the printed circuit board shaped as a cylindrical disk and disposed on an end-face of a motor proximate to the first surface;
• one or more switching semiconductor devices disposed on the first surface;
• and
• a thermal management assembly thermally connected to the printed circuit board, the thermal management assembly comprising:
• a cooling jacket disposed around a circumference of the motor;
• at least one jacket manifold formed through the cooling jacket, the at least one jacket manifold having a fluid inlet and a fluid outlet and defining a fluid flow area therebetween;
• a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices;
• a cooling manifold disposed through the printed circuit board to form a fluid flow path through the printed circuit board;
• and
• two or more electrically insulated posts disposed between the at least one jacket manifold and the cooling manifold and having a cooling channel through individual electrically insulated posts, wherein the cooling channel in at least a first electrically insulated post fluidly connects the fluid inlet to the cooling manifold to form an inward fluid path and the cooling channel in at least a second electrically insulated post fluidly connects the cooling manifold to the fluid outlet to form an outward fluid path.