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US 11,153,985 B2Granted
Modular hybrid circuit packaging
AssigneeRosemount Inc.
InventorsDavid Alexander Andrew, David Matthew Strei, James Walters, III, David Cutter
Life of this patent
Estimating the term…
Abstract
An electronics package includes a platform and a board mounted to the platform, the board having electronics mounted thereon. A feedthrough pin passes through and is hermetically sealed to a feedthrough body and is wire bonded to the board. A cover is bonded to and surrounds the exterior surface of the feedthrough body to produce a hermetically sealed chamber that houses the platform and the board.
Claims17
An electronics package comprising:
- a platform;
- a board mounted to the platform, the board having electronics mounted thereon;
- at least one feedthrough body having an exterior surface, wherein the platform is mounted to the feedthrough body;
- a feedthrough pin, passing through and hermetically sealed to the feedthrough body and connected to the board;
- and
- a cover attached to and surrounding the exterior surface of the feedthrough body to produce a hermetically sealed chamber that houses the platform and the board such that the board is spaced from the feedthrough body and a surface of the feedthrough body is exposed to the sealed chamber;
- wherein a coefficient of thermal expansion of the platform and a coefficient of thermal expansion of the board are similar and selected to prevent the board from breaking free from the platform due to thermal expansion;
- a sensor body surrounding at least one sensor and having an exterior surface, wherein the cover is bonded to and surrounds a portion of the exterior surface of the sensor body and the sensor body is positioned opposite the feedthrough body and defines the hermetically sealed chamber of the cover therebtween;
- and
- wherein a coefficient of thermal expansion of the cover is different from the coefficient of thermal expansion of the board.
7 more elements
An electronics package comprising:
- a feedthrough body;
- a second body;
- a cover bonded to the feedthrough body and the second body to form a hermetically sealed chamber, the platform mounted to at least one of the feedthrough body and the second body;
- a platform positioned between a surface of the feedthrough body exposed to the sealed chamber and the second body within the sealed chamber;
- and
- a board having electrical components mounted thereon wherein the board is mounted to the platform within the chamber and is spaced from the feedthrough body;
- wherein a coefficient of thermal expansion of the platform and a coefficient of thermal expansion of the board are similar and selected to prevent the board from breaking free from the platform due to thermal expansion;
- wherein a coefficient of thermal expansion of the cover is different from the coefficient of thermal expansion of the board;
- and
- wherein the second body comprises a sensor body containing a sensor, the sensor body is positioned opposite feedthrough body and defines the hermetically sealed chamber of the cover therebetween.
7 more elements
Dependencies are inferred from the claim text.