Circuit carrier, package, and method for manufacturing a package
AssigneeSiemens Aktiengesellschaft
InventorStefan Pfefferlein
Life of this patent
Estimating the term…
Abstract
A circuit carrier includes a first side, two layers arranged to define an intermediate space there between, with at least one of the two layers being electrically conductive and attached to the first side. The at least one of the two layers has a region deformed such as to exhibit an indentation and has a trace structure in the indentation. A first insulating material fills the intermediate space, and a second insulating material fills the indentation, A second side in opposition to the first side is shaped to have in the deformed region a cut-out for receiving a bare die such as to come into an electrical contact with the at least one of the two layers.
Claims12
A circuit carrier, comprising:
- a first side;
- two layers arranged to define an intermediate space there between, at least one of the two layers being electrically conductive and attached to the first side, said at least one of the two layers having a region deformed such as to exhibit an indentation, said at least one of the two layers having a trace structure in the indentation;
- a first insulating material filling the intermediate space;
- a second insulating material filling the indentation;
- and
- a second side in opposition to the first side and having in the deformed region a cut-out for receiving a bare die such as to come into an electrical contact with the at least one of the two layers.
A package, comprising:
- a circuit carrier including a first side, two layers arranged to define an intermediate space there between, at least one of the two layers being electrically conductive and attached to the first side, said at least one of the two layers having a region deformed such as to exhibit an indentation, said at least one of the two layers having a trace structure in the indentation, a first insulating material filling the intermediate space, a second insulating material filling the indentation, and a second side in opposition to the first side and having in the deformed region a cut-out;
- and
- a bare die populated in the cut-out such as to come into an electrical contact with the at least one of the two layers.
Dependencies are inferred from the claim text.