Back to results
US 11,153,973 B2Granted
Electronic module
AssigneeCyntec Co., Ltd.
InventorsKaipeng Chiang, Da-Jung Chen, Bau-Ru Lu, Chun Hsien Lu
Life of this patent
Estimating the term…
Abstract
An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
Claims20
An electronic module, comprising:
- a circuit board, wherein a plurality of electronic devices are disposed on a top surface of the circuit board;
- an inductor, disposed on a bottom surface of the circuit board;
- and
- a plurality of wave pins, disposed under the bottom surface of the circuit board, wherein a first wave pin comprises a conductive body and a recess on a bottom surface of the conductive body, wherein the inductor is electrically connected to the first wave pin, wherein a top surface of the conductive body is in contact with the bottom surface of the circuit board with a first portion of the conductive body extending vertically from a first portion of said top surface of the conductive body to the recess, wherein a second portion of the conductive body extends vertically from an outer portion of the bottom surface of the conductive body to a second portion of said top surface of the conductive body, said outer portion of the bottom surface of the conductive body being located at a lateral side of the recess.
1 more element
An electronic module, comprising:
- a circuit board, wherein a plurality of electronic devices are disposed on a top surface of the circuit board;
- a power inductor, disposed on a bottom surface of the circuit board;
- and
- a plurality of power pins and a plurality of signal pins, disposed on the bottom surface of the circuit board, wherein the size of a first power pin is larger than that of a signal pin, and the power inductor is electrically connected to the first power pin, wherein the first power pin comprises a conductive body and a recess on a bottom surface of the conductive body, wherein a top surface of the conductive body is in contact with the bottom surface of the circuit board with a first portion of the conductive body extending vertically from a first portion of said top surface of the conductive body to the recess, wherein a second portion of the conductive body extends vertically from an outer portion of the bottom surface of the conductive body to a second portion of said top surface of the conductive body, said outer portion of the bottom surface of the conductive body being located at a lateral side of the recess.
1 more element
Dependencies are inferred from the claim text.