Apparatus with electrical components end mounted to printed circuit board

An apparatus comprising:

• a printed circuit board having a first major surface, a second major surface opposite the first major surface, and a minor surface perpendicular to the first major surface and the second major surface;
• an electronic component comprising a ball grid array, having spaced apart solder balls, on a mounting surface of the electronic component, wherein the electronic component is mounted to the minor surface of the printed circuit board such that the mounting surface is parallel to the minor surface and perpendicular to the first major surface and the second major surface, and the solder balls of the ball grid array are electrically connected to both the first major surface and the second major surface of the printed circuit board;
• and
• a support bracket in contact with the mounting surface of the electronic component, the first major surface of the printed circuit board, and the second major surface of the printed circuit board.

An apparatus comprising:

• a printed circuit board having a first major surface, a second major surface opposite the first major surface, and a minor surface perpendicular to the first major surface and the second major surface;
• an electronic component comprising a ball grid array, having spaced apart solder balls, on a mounting surface of the electronic component, wherein the electronic component is mounted to the minor surface of the printed circuit board such that the mounting surface is parallel to the minor surface and perpendicular to the first major surface and the second major surface, and the solder balls of the ball grid array are electrically connected to both the first major surface and the second major surface of the printed circuit board;
• and
• a second electronic component and a third electronic component mounted to a second minor surface and a third minor surface of the printed circuit board, respectively, wherein the second minor surface and the third minor surface are parallel to the minor surface of the printed circuit board.

A method of automatically making an apparatus, the method comprising:

• individually picking light-emitting diodes (LEDs) from a carrier tape, comprising a plurality of LEDs, with an automated tool;
• individually flipping over each one of the LEDs picked from the carrier tape with and relative to the automated tool;
• after flipping over each one of the LEDs, placing the LEDs relative to each other to form an LED nest comprising a plurality of LEDs arranged in a predetermined pattern corresponding with a pattern of electrical contact pads on a printed circuit board;
• optically verifying an orientation and a location of electrical contact pads of a printed circuit board using a sensor;
• based on a verified orientation and a verified location of the electrical contact pads, moving the printed circuit board, with the automated tool or a second automated tool, such that corresponding ones of the electrical contact pads of the printed circuit board are aligned with the LEDs in the LED nest;
• applying solder paste to the corresponding ones of the electrical contact pads and the LEDs;
• reflowing the solder paste applied to the electrical contact pads and the LEDs;
• optically verifying a location of solder balls of a camera, using the sensor or a second sensor;
• based on the verified orientation and the verified location of the electrical contact pads and a verified location of the solder balls of the camera, moving the camera such that the solder balls of the camera are aligned with corresponding ones of the electrical contact pads;
• applying solder paste to the solder balls and the electrical contact pads aligned with the solder balls;
• and
• reflowing the solder paste applied to the solder balls and the electrical contact pads aligned with the solder balls.