US 11,153,968 B2Granted

Device, system and method to promote the integrity of signal communications

AssigneeIntel Corporation

InventorsJackson Chung Peng Kong, Bok Eng Cheah, Khang Choong Yong, Yun Ling, Chia Voon Tan

Life of this patent

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Abstract

Techniques and mechanisms for mitigating the effect of signal noise on communication via an interconnect. In an embodiment, a substrate includes an interconnect and a conductor which has a hole formed therein. Portions of the interconnect variously extend over a side of the conductor, wherein another recess portion of the interconnect extends from a plane which includes the side, and further extends at least partially into the hole. The configuration of the recess portion extending within the hole may contribute to an impedance which dampens a transmitter slew rate of the communication. In an embodiment, a total distance along a path formed by the interconnect is equal to or less than 5.5 inches.

Claims25

Dependent claims

A circuit device for mitigating loss of signal integrity, the circuit device comprising:

a substrate comprising:
a conductor comprising:
a side region which extends in a plane;
and
a sidewall structure which defines at least in part a hole which extends from the plane and at least partially through the conductor;
and
an interconnect to communicate a signal between a first circuit and a second circuit while the conductor provides a reference potential, wherein the interconnect comprises:
a first portion and a second portion each disposed above the plane and offset from the side region;
and
a third portion which extends between, and to each of, the first portion and the second portion, the third portion comprising a recess portion which extends through the plane and into the hole, wherein from the first portion to the second portion, one or more dielectrics layers are adjacent to the third portion to provide an electrical insulation along an entire length of the third portion, wherein the third portion is directly coupled electrically to only the first portion and the second portion.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/841,880Filed 14 Dec 2017
Published: US 2019/0045625 A17 Feb 2019
Granted: 19 Oct 2021
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

H05K 1/0245
High frequency adaptations: lay-out of balanced signal pairs, e.g. differential lines or twisted lines
H05K 1/0225
Patterned shielding planes, ground planes or power planes: single or multiple openings in a shielding, ground or power plane
H05K 1/0251
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: related to vias or transitions between vias and transmission lines
H05K 1/0253
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: impedance adaptations of transmission lines by special lay-out…