Thin-film filter, thin-film filter substrate, method of manufacturing the thin-film filter, method of manufacturing the thin-film filter substrate, MEMS microphone and method of manufacturing the MEMS microphone

A thin-film filter substrate comprising:

• a base substrate having a base surface;
• and
• a thin-film filter being formed on the base surface of the base substrate,
• wherein the thin-film filter comprises a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface, and stripes-formed inner wall surfaces having stripe-like parts formed along with an intersecting direction intersecting the film surface, the stripes-formed inner wall surfaces are formed inside the respective through holes.

A method of manufacturing a thin-film filter comprising:

• a peeling-off adhesive layer forming step of forming a peeling-off adhesive layer, capable of being peeled off, on a base substrate;
• a thin-film filter forming step of forming a thin-film filter on the peeling-off adhesive layer;
• and
• a thin-film filter peeling-off step of peeling off the thin-film filter from the peeling-off adhesive layer of a thin-film filter substrate, which the peeling-off adhesive layer and the thin-film filter are formed by performing the peeling-off adhesive layer forming step and the thin-film filter forming step,
• wherein the thin-film filter forming step comprises a resin layer forming step of forming a resin layer on the peeling-off adhesive layer of the base substrate, and a through hole forming step of forming through holes which penetrate from a surface to the rear surface of the resin layer, so that stripes-formed inner wall surfaces, having stripe-like parts formed along with an intersecting direction intersecting the surface of the resin layer, are formed.

A method of manufacturing a thin-film filter substrate, which a thin-film filter is formed on a base substrate comprising:

• a peeling-off adhesive layer forming step of forming a peeling-off adhesive layer, capable of being peeled off, on the base substrate;
• and
• a thin-film filter forming step of forming a thin-film filter on the peeling-off adhesive layer,
• wherein the thin-film filter forming step comprises a resin layer forming step of forming a resin layer on the peeling-off adhesive layer of the base substrate, and a through hole forming step of forming through holes which penetrate from a surface to the rear surface of the resin layer, so that stripes-formed inner wall surfaces, having stripe-like parts formed along with an intersecting direction intersecting the surface of the resin layer, are formed.

A MEMS microphone comprising:

• a MEMS chip;
• a package substrate which the MEMS chip is adhered;
• and
• a thin-film filter formed on the package substrate or the MEMS chip,
• wherein the thin-film filter comprises a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface,
• a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface, and
• stripes-formed inner wall surfaces having stripe-like parts formed along with an intersecting direction intersecting the film surface, the stripes-formed inner wall surfaces are formed inside the respective through holes.

A method of manufacturing a MEMS microphone using a MEMS chip and a package substrate which the MEMS chip is adhered comprising:

• a photosensitive-adhesive layer forming step of forming a photosensitive-adhesive layer, made of photosensitive-adhesive, on a surface of a package-panel which a plurality of package-regions for manufacturing the package substrate are formed;
• a thin-film filter peeling-off step of peeling-off a thin-film filter from a peeling-off adhesive layer of a thin-film filter substrate, which is manufactured by performing a peeling-off adhesive layer forming step of forming the peeling-off adhesive layer, capable of being peeled off, on a base substrate and a thin-film filter forming step of forming the thin-film filter on the peeling-off adhesive layer;
• and
• a thin-film filter transcribing step for transcribing the thin-film filter, peeled off by the thin-film filter peeling-off step, to the package-panel,
• wherein the thin-film filter forming step comprises a resin layer forming step of forming a resin layer on the peeling-off adhesive layer of the base substrate, and a through hole forming step of forming through holes which penetrate from a surface to the rear surface of the resin layer, so that stripes-formed inner wall surfaces, having stripe-like parts formed along with an intersecting direction intersecting the surface of the resin layer, are formed.