Technologies for densely packaging network components for large scale indirect topologies
AssigneeIntel Corporation
InventorsMario Flajslik, Eric R. Borch, Michael A. Parker, Richard J. Dischler
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AssigneeIntel Corporation
InventorsMario Flajslik, Eric R. Borch, Michael A. Parker, Richard J. Dischler
Estimating the term…
Technologies for densely packaging network components for large scale indirect topologies include group of switches. The group of switches includes a stack of node switches that includes a first set of ports and a stack of global switches that includes a second set of ports. The stack of node switches are oriented orthogonally to the stack of global switches. Additionally, the first set of ports are oriented towards the second set of ports and the node switches are connected to the global switches through the first and second sets of ports. Other embodiments are also described and claimed.
A group of switches comprising:
A method for assembling a group of switches, the method comprising:
Dependencies are inferred from the claim text.
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Details: arrangements for remote connection or disconnection of substations or of equipment thereof
Characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]: star or tree networks
Configuration management of networks or network elements: configuration setting
Arrangements for maintenance, administration or management of data switching networks, e.g. of packet switching networks: discovery or management…
About 12 years 11 months of term left · ends 6 Oct 2039 (estimated)
Typical solutions for physically assembling groups of networking components, such as switches, for use in large scale indirect network topologies, such as a three-level fat-tree topology (e.g., a topology in which nodes are connected to node switches, which are connected to global switches, which, in turn, are connected to root switches), or a Megafly topology (e.g., a topology in which nodes are connected to node switches, which are connected to global switches, which, in turn, are connected directly to other global switches), are relatively low density. For example, a typical solution is to place a node switch at the top of a cabinet of nodes and connect the node switches from the various cabinets to global switches, which may be located elsewhere. This arrangement is costly as it can require long cables to connect each node switch to the corresponding global switches (e.g., switches that route packets from the present group to another group of switches and nodes). Other solutions that provide higher density typically do so at the cost of signal integrity. For example, one solution involves doubling the number of nodes connected to a single node switch (e.g., doubling from 16 nodes to 32 nodes). However, doubling the number of nodes and co-locating all of the nodes with the single node switch may decrease the integrity of signals carrying data to and from the node switch (e.g., due to electromagnetic interference between the connections).
The concepts described herein are illustrated by way of example and not by way of limitation in the accompanying figures. For simplicity and clarity of illustration, elements illustrated in the figures are not necessarily drawn to scale. Where considered appropriate, reference labels have been repeated among the figures to indicate corresponding or analogous elements.
FIG. 1 is a simplified block diagram of at least one embodiment of a system in which global switches and node switches of a group are densely packaged together in a large scale indirect network topology;
FIG. 2 is a simplified block diagram of at least one embodiment of a global switch of the system of FIG. 1;
While the concepts of the present disclosure are susceptible to various modifications and alternative forms, specific embodiments thereof have been shown by way of example in the drawings and will be described herein in detail. It should be understood, however, that there is no intent to limit the concepts of the present disclosure to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives consistent with the present disclosure and the appended claims.
References in the specification to “one embodiment,” “an embodiment,” “an illustrative embodiment,” etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may or may not necessarily include that particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described. Additionally, it should be appreciated that items included in a list in the form of “at least one A, B, and C” can mean (A); (B); (C); (A and B); (A and C); (B and C); or (A, B, and C). Similarly, items listed in the form of “at least one of A, B, or C” can mean (A); (B); (C); (A and B); (A and C); (B and C); or (A, B, and C).
The disclosed embodiments may be implemented, in some cases, in hardware, firmware, software, or any combination thereof. The disclosed embodiments may also be implemented as instructions carried by or stored on a transitory or non-transitory machine-readable (e.g., computer-readable) storage medium, which may be read and executed by one or more processors. A machine-readable storage medium may be embodied as any storage device, mechanism, or other physical structure for storing or transmitting information in a form readable by a machine (e.g., a volatile or non-volatile memory, a media disc, or other media device).