Fast radio frequency package
AssigneeInternational Business Machines Corporation
InventorsAndreas Fuhrer Janett, Stephan Paredes, Thilo Hermann Curt Stoeferle, Stefan Filipp, Matthias Mergenthaler
Life of this patent
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Abstract
A device package includes a chip carrier having a cavity and one or more microwave waveguides configured to route signals. There is a chip including one or more pads and located within the cavity of the chip carrier. Each pad is aligned with a corresponding connector pad of a microwave waveguide of the one or more microwave waveguides of the chip carrier. At least one of the one or more pads is coupled to the connector pad of the corresponding microwave waveguide by way of an overlap capacitive coupling between the at least one pad and the aligned corresponding connector pad of the microwave waveguide.
Claims20
A device package, comprising:
- a chip carrier having a cavity and one or more microwave waveguides configured to route signals;
- and
- a chip comprising one or more pads and located within the cavity of the chip carrier wherein:
- each pad is aligned with a corresponding connector pad of a microwave waveguide of the one or more microwave waveguides of the chip carrier;
- and
- at least one of the one or more pads is coupled to the connector pad of the corresponding microwave waveguide by way of an overlap capacitive coupling between the at least one pad and the aligned corresponding connector pad of the microwave waveguide.
A chip packaging system, comprising:
- a chip carrier having a cavity and one or more microwave waveguides configured to route signals;
- an interposer chip comprising one or more pads and located within the cavity of the chip carrier;
- and
- one or more chips bonded to the interposer chip, wherein:
- each pad of the interposer chip is aligned with a corresponding connector pad of a microwave waveguide of the one or more microwave waveguides of the chip carrier;
- and
- at least one of the one or more pads is coupled to the connector pad of the corresponding microwave waveguide by way of an overlap capacitive coupling between the at least one pad and the aligned corresponding connector pad of the microwave waveguide.
A method of packaging a chip, comprising:
- providing a chip carrier having a cavity and one or more microwave waveguides to route signals;
- guiding a chip comprising one or more pads into the cavity of the chip carrier;
- aligning each pad of the chip with a corresponding connector pad of a microwave waveguide of the one or more microwave waveguides of the chip carrier;
- and
- coupling at least one of the one or more pads to the connector pad of the corresponding microwave waveguide by way of an overlap capacitive coupling between the at least one pad and the aligned corresponding connector pad of the microwave waveguide.
Dependencies are inferred from the claim text.