Reducing error rates with alpha particle protection
AssigneeInternational Business Machines Corporation
InventorsDaniel L. Stasiak, Hassan Naser, Michael J. Mueller, Kenneth P. Rodbell, Philip J. Oldiges
Life of this patent
Estimating the term…
Abstract
An integrated circuit package with a buffer providing radiation protection to memory elements and components is described. The integrated circuit packages and the incorporated buffers provide a protective distance between potential sources of internal radiation particles within the integrated circuit package and any memory elements/components which may be sensitive to radiation such as alpha particles. This protective distance allows for the integrated circuit packages to be completed or assembled without needing added more expensive or redundant memory components.
Claims20
An integrated circuit package comprising:
- a solder layer disposed on a package substrate, wherein the solder layer comprises at least one radiation emitting component;
- a semiconductor buffer layer disposed on the solder layer, wherein the semiconductor buffer layer comprises at least one electrical connection path formed in the semiconductor buffer layer;
- and
- a memory layer disposed on the semiconductor buffer layer, wherein the memory layer comprises at least one memory component, wherein the semiconductor buffer layer provides radiation protection for the at least one memory component.
A radiation buffer for an integrated circuit package comprising:
- a semiconductor buffer disposed between a radiation emitting component of an integrated circuit package and a radiation sensitive component of an integrated circuit package, wherein the semiconductor buffer comprises at least one electrical connection path formed in the semiconductor buffer, wherein the at least one electrical connection path provides an electrical connection between the radiation emitting component and the radiation sensitive component.
A method for manufacturing an integrated circuit package with radiation protection, comprising:
- providing a first semiconductor layer;
- forming at least one electrical connection path through the first semiconductor layer;
- forming a memory layer on a first surface of the first semiconductor layer, wherein at least one component in the memory layer is electrically connected to the at least one electrical connection path;
- and
- affixing a second surface of the first semiconductor layer to a solder layer disposed on a package substrate,
- wherein the solder layer comprises at least one radiation emitting component, and
- wherein the first semiconductor layer provides a radiation protection for the at least one component in the memory layer.
Dependencies are inferred from the claim text.