Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces

A method of manufacturing a glass piece, the method comprising:

• forming a mold substrate of a single-crystalline material by etching a sharp-angled cavity into a working surface of the mold substrate;
• bringing a source material based on a glass in contact with the working surface provided with the sharp-angled cavity;
• and
• pressing the source material and the mold substrate against each other,
• wherein a temperature of the source material and a force exerted on the source material are controlled such that source material is fluidified and flows into the sharp-angled cavity,
• wherein the sharp angles of the sharp angled cavity are disposed below the working surface,
• wherein the sharp-angled cavity comprises a first region that vertically extends from the working surface of the mold substrate and a second region that connects with the first region and laterally extends away from the first region with an upper surface of the second region being separated from the working surface by a section of the mold substrate.

A method of manufacturing a glass piece, the method comprising:

• forming a mold substrate of a single-crystalline material by etching a sharp-angled cavity into a working surface of the mold substrate;
• bringing a source material based on a glass in contact with the working surface provided with the sharp-angled cavity;
• and
• pressing the source material and the mold substrate against each other,
• wherein a temperature of the source material and a force exerted on the source material are controlled such that source material is fluidified and flows into the sharp-angled cavity,
• wherein the sharp angles of the sharp angled cavity are disposed below the working surface, and
• wherein the sharp angles of the sharp angled cavity comprise a corner between first and second planar walls of the sharp angled cavity, wherein the first planar wall is disposed below and runs parallel to the working surface of the substrate, and wherein the second planar wall is disconnected from and runs perpendicular to the working surface of the substrate.