Microelectronic package electrostatic discharge (ESD) protection
AssigneeIntel Corporation
InventorsVeronica Aleman Strong, Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid
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Abstract
Embodiments may relate to a material to provide electrostatic discharge (ESD) protection in an electrical device. The material may include first and second electrically-conductive carbon allotropes. The material may further include an electrically-conductive polymer that is chemically bonded to the first and second electrically-conductive carbon allotropes such that an electrical signal may pass between the first and second electrically-conductive carbon allotropes. Other embodiments may be described or claimed.
Claims20
A material to provide electrostatic discharge (ESD) protection in an electrical device, wherein the material comprises:
- a first electrically-conductive carbon allotrope having a first functional group;
- a second electrically-conductive carbon allotrope having a second functional group;
- and
- a first electrically-conductive polymer that is chemically bonded to the first functional group and the second functional group such that an electrical signal may pass between the first and second electrically-conductive carbon allotropes.
A microelectronic package for use in an electronic device, wherein the microelectronic package comprises:
- a signal path electrically positioned between, and coupled to, a die and a voltage input;
- a ground signal path electrically positioned between, and coupled to, a connection to ground and the signal path;
- and
- an electrostatic discharge (ESD) protection material coupled to the ground signal path, wherein the ESD protection material includes a first electrically-conductive carbon allotrope having a first functional group, a second electrically-conductive carbon allotrope having a second functional group, and an electrically-conductive polymer that chemically bonds with the first functional group and the second functional group such that the first and second electrically-conductive carbon allotropes are chemically bonded to one another within a non-conductive material.
A method of forming a microelectronic package for use in an electronic device, wherein the method comprises:
- identifying, in a substrate of the microelectronic package, a ground path that electrically couples a signal path and a ground connection;
- and
- positioning, in the ground path between the signal path and the ground connection, an electrostatic discharge (ESD) protection material that includes:
- two electrically-conductive carbon allotropes that are electrically coupled with one another by a first electrically-conductive polymer that is chemically functionalized with the electrically-conductive carbon allotropes;
- and
- a non-conductive polymer matrix that is chemically functionalized with the electrically-conductive carbon allotropes by a second electrically-conductive polymer.
Dependencies are inferred from the claim text.