Fluid cooling system for an enclosed electronic package
AssigneeBaidu USA LLC
InventorTianyi Gao
Life of this patent
Estimating the term…
Abstract
A fluid cooling system for an electronics package having a chassis is disclosed. The system includes an electronics package housed within a chassis, one or more mounting structures attached to the chassis, and a fluid cooling module interfaced with one or more electronics of the electronics package, the fluid cooling module housed within the chassis and mounted to the one or more mounting structures, where circulation of a fluid of the fluid cooling module cools the one or more electronics. A chassis fluid distribution manifold is used to connect with the chassis fluid inlet and outlet and to distribute fluid within the chassis.
Claims20
A fluid cooling system, comprising:
- an electronics package mounted on a motherboard housed within a chassis;
- a first mounting structure attached to a first side panel of the chassis, including a first vertical mounting slot;
- a second mounting structure attached to a second side panel of the chassis, including a second vertical mounting slot;
- and
- a fluid cooling module across on top of the electronics package, wherein the fluid cooling module is mounted on the first and second mounting structures by inserting a first end and a second end of the fluid cooling module into the first and second vertical mounting slots,
- wherein the fluid cooling module is to provide fluid cooling to a cooling plate attached to a top surface of the electronics package, wherein the fluid cooling module includes a mounting rail attached to a mounting frame, the mounting frame attached to the first and second mounting structures of the chassis.
A data processing system housed within a chassis, comprising:
- a motherboard;
- a central processing unit (CPU) mounted on the motherboard;
- an electronics package mounted on the motherboard housed within the chassis;
- a first mounting structure attached to a first side panel of the chassis, including a first vertical mounting slot;
- a second mounting structure attached to a second side panel of the chassis, including a second vertical mounting slot;
- and
- a fluid cooling module across on top of the electronics package, wherein the fluid cooling module is mounted on the first and second mounting structures by inserting a first end and a second end of the fluid cooling module into the first and second vertical mounting slots,
- wherein the fluid cooling module is to provide fluid cooling to a cooling plate attached to a top surface of the electronics package, wherein the fluid cooling module includes a mounting rail attached to a mounting frame, the mounting frame attached to the first and second mounting structures of the chassis.
An electronic rack of a data center, comprising:
- an array of server blades arranged in a stack, each server blade including one or more servers housed within a chassis, each of the one or more servers comprises:
- a motherboard;
- a central processing unit (CPU) mounted on the motherboard;
- an electronics package mounted on the motherboard housed within the chassis;
- a first mounting structure attached to a first side panel of the chassis, including a first vertical mounting slot;
- a second mounting structure attached to a second side panel of the chassis, including a second vertical mounting slot;
- and
- a fluid cooling module across on top of the electronics package, wherein the fluid cooling module is mounted on the first and second mounting structures by inserting a first end and a second end of the fluid cooling module into the first and second vertical mounting slots,
- wherein the fluid cooling module is to provide fluid cooling to a cooling plate attached to a top surface of the electronics package, wherein the fluid cooling module includes a mounting rail attached to a mounting frame, the mounting frame attached to the first and second mounting structures of the chassis.
Dependencies are inferred from the claim text.