Method for producing semiconductor device
AssigneeShowa Denko Materials Co., Ltd.
InventorsTomoaki Shibata, Hanako Yori, Tomonori Minegishi, Hidenori Abe, Takashi Masuko, Shunsuke Otake
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Abstract
Disclosed is a method for producing a semiconductor device including a circuit board having a flexible resin layer that encapsulates a circuit component. The method may include a step of immersing a flexible substrate in an encapsulant, drying the encapsulant, and thereby encapsulating the circuit component with the encapsulant; and a step of curing the encapsulant, and thereby forming a flexible resin layer.
Claims6
A method for producing a semiconductor device including a circuit board having a flexible substrate, a circuit component mounted on the flexible substrate, and a flexible resin layer encapsulating the circuit component,
- the method comprising:
- a step of laminating an encapsulant on the flexible substrate, and thereby encapsulating the circuit component with the encapsulant;
- and
- a step of curing the encapsulant, and thereby forming the flexible resin layer,
- wherein the recovery factor R of the flexible resin layer is 80% or higher, the recovery factor R is calculated by the formula R=Y/X, wherein X is the strain added to a measurement sample of the flexible resin layer during a first tensile test, and Y is the position at which load begins to be applied when the measurement sample is subsequently returned to the initial position and a second tensile test is performed.
Dependencies are inferred from the claim text.