Printed circuit board assembly of an implantable medical device
AssigneeBIOTRONIK SE & Co. KG
InventorsRoman Meier, Dany Quahs, Jan Romberg
Life of this patent
Estimating the term…
Abstract
A printed circuit board assembly of an implantable medical device comprises a printed circuit board and a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer. It is provided in the process that the adhesive layer is formed of an adhesive compound in which glass spheres are embedded. In this way, a printed circuit board assembly is provided which, in a simple, inexpensive manner, allows a sensor device to be joined to a printed circuit board for installation in a medical device, with advantageous mechanical decoupling and improved process reliability.
Claims6
A printed circuit board assembly of an implantable medical device, comprising:
- a printed circuit board, and
- a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer, wherein the adhesive layer is formed of an adhesive compound in which glass spheres are embedded,
- wherein the glass spheres have a modulus of elasticity between 40000 N/mm2 and 90000 N/mm2,
- wherein the glass spheres have a diameter between 30 μm and 50 μm,
- wherein the proportion of the glass spheres in the adhesive layer is between 8% by weight and 20% by weight, and
- wherein the sensor device is a transducer for converting a pressure signal into an electrical signal.
A method for producing a printed circuit board assembly of an implantable medical device, comprising:
- joining a sensor device to a printed circuit board by way of an adhesive layer, wherein the adhesive layer is formed of an adhesive compound into which glass spheres are mixed,
- wherein the glass spheres have a modulus of elasticity between 40000 N/mm2 and 90000 N/mm2,
- wherein the glass spheres have a diameter between 30 μm and 50 μm,
- wherein the proportion of the glass spheres in the adhesive layer is between 8% by weight and 20% by weight, and
- wherein the sensor device is a transducer for converting a pressure signal into an electrical signal.
Dependencies are inferred from the claim text.