Semiconductor module unit
AssigneeYazaki Corporation
InventorsMitsuaki Morimoto, Eiichiro Oishi
Life of this patent
Estimating the term…
Abstract
A semiconductor module unit includes a semiconductor module, and a control board that includes a driver circuit configured to output drive signals to the semiconductor module and controls the semiconductor module. The control board includes a main board, a sub board that is separated from the main board and on which the driver circuit is mounted, and a flexible board that has flexibility and electrically connects the main board and the sub board. The sub board includes a fitting part that is fitted in a fitted part of the semiconductor module. The semiconductor module is electrically connected to the driver circuit in a state where the fitting part is fitted in the fitted part.
Claims6
A semiconductor module unit, comprising:
- a semiconductor module that includes at least a semiconductor element;
- and
- a control board that includes a driver circuit configured to output a drive signal to the semiconductor module and controls the semiconductor module, wherein
- the control board includes
- a main board,
- a sub board that is separated from the main board and on which the driver circuit is mounted, and
- a flexible board that has flexibility and electrically connects the main board and the sub board,
- the sub board includes
- a fitting part that is fitted to the semiconductor module, and
- a connecting portion that is arranged in the fitting part, and is electrically connected to the driver circuit,
- the semiconductor module includes
- a fitted part that is made of a resin member sealing the semiconductor element and that is fitted to the fitting part, and
- a connected portion with one end electrically connected to the semiconductor element, an other end exposed from the resin member and the other end arranged in the fitted part, and
- the semiconductor module is electrically connected to the driver circuit by a connection of the fitting part and the fitted part when the fitting part is fitted in the fitted part as a solderless connection.
Dependencies are inferred from the claim text.