Flexible substrate, electronic device, and method for manufacturing electronic device

An electronic device, comprising:

• first and second flexible substrates, each substrate comprising:
• a flexible base;
• a first conductive wiring formed on the flexible base and comprising a conductive organic compound;
• and
• an electronic element connected to the first conductive wiring,
• wherein a first part of the first conductive wiring of the first flexible substrate is in direct contact and united with a first part of the first conductive wiring of the second flexible substrate to form a first connection part so that the first flexible substrate and the second flexible substrate are electrically and mechanically connected to each other via the first connection part;
• and
• a third flexible substrate, comprising:
• a flexible base;
• and
• a first conductive wiring formed on the flexible base and comprising a conductive organic compound,
• wherein the first flexible substrate further comprises a second conductive wiring that is formed on the flexible base and comprises a conductive organic compound, a first part of the first conductive wiring of the third flexible substrate is in direct contact and united with a first part of the second conductive wiring of the first flexible substrate to form a second connection part so that the first flexible substrate and the third flexible substrate are electrically and mechanically connected to each other via the second connection part.

An electronic device, comprising:

• first and second flexible substrates, each substrate comprising:
• a flexible base;
• a first conductive wiring formed on the flexible base and comprising a conductive organic compound;
• and
• an electronic element connected to the first conductive wiring,
• wherein a first part of the first conductive wiring of the first flexible substrate is in direct contact and united with a first part of the first conductive wiring of the second flexible substrate to form a first connection part so that the first flexible substrate and the second flexible substrate are electrically and mechanically connected to each other via the first connection part,
• wherein each of the first flexible substrate and the second flexible substrate further comprises:
• a second conductive wiring formed on the flexible base and comprising the conductive organic compound, and
• a wiring space area formed between the first conductive wiring and the second conductive wiring, and
• the electronic device further comprises an adhesion layer comprising an insulating material, the adhesion layer being formed between the base and the first conductive wiring in at least one of the first flexible substrate and the second flexible substrate, so that the wiring space area of the first flexible substrate adheres to the wiring space area of the second flexible substrate by the adhesion layer.