Circuit board and method for manufacturing same
AssigneeStemco Co., Ltd.
InventorsSang Chul Lee, Hyo Jin Park
Life of this patent
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Abstract
Disclosed herein are a circuit board and a method of fabricating the same. The circuit board includes: a base substrate having a device mount area defined thereon; a first wiring pattern formed on a first surface of the base substrate; a dummy pattern formed on the base substrate, wherein at least a part of the device mount area is filled with the dummy pattern; a first protective layer covering the first wiring pattern and the dummy pattern; and a lead pattern formed on the first protective layer, wherein the lead pattern is extended to the device mount area.
Claims14
A circuit board comprising:
- a base substrate having a device mount area defined thereon;
- a first wiring pattern formed on a first surface of the base substrate;
- a dummy pattern formed on the base substrate, wherein at least a part of the device mount area is filled with the dummy pattern;
- a first protective layer covering the first wiring pattern and the dummy pattern;
- and
- a lead pattern formed on the first protective layer, wherein the lead pattern is extended to the device mount area,
- wherein the dummy pattern comprises:
- a hole via which the base substrate in the device mount area is exposed;
- and
- a periphery around the hole, and
- wherein the lead pattern is not formed on the hole,
- wherein the lead pattern comprises a bonding portion where a device is mounted in the device mount area,
- wherein the dummy pattern is expanded outwardly of the bonding portion by a first distance, and
- wherein the dummy pattern is formed at a same level as the first wiring pattern and is not connected to a pattern of other layer.
A method of fabricating a circuit board, the method comprising:
- providing a base substrate having a device mount area defined thereon;
- forming a wiring pattern and a dummy pattern on a first surface of the base substrate, wherein the dummy pattern is formed in the device mount area;
- forming a first protective layer to cover the wiring pattern and the dummy pattern;
- and
- forming a lead pattern extended from the device mount area on the first protective layer,
- wherein the dummy pattern comprises:
- a hole via which the base substrate in the device mount area is exposed;
- and
- a periphery around the hole, and
- wherein the lead pattern is not formed on the hole,
- wherein the lead pattern comprises a bonding portion where a device is mounted in the device mount area,
- wherein the dummy pattern is expanded outwardly of the bonding portion by a first distance, and
- wherein the dummy pattern is formed at a same level as the first wiring pattern and is not connected to a pattern of other layer.
Dependencies are inferred from the claim text.