Mems microphone with improved connection structure and method for manufacturing the same

A method for manufacturing a MEMS microphone with an improved connection structure, comprising:

• Step S1, preparing at least a substrate, an acoustic transducer, an integrated circuit chip, and a cover, wherein the manufacturing of the integrated circuit chip comprises:
• Step 11, forming a first semiconductor layer and a second semiconductor pre-processing layer located at a bottom of the first semiconductor layer, respectively, wherein a first bonding pad is formed on a first surface of the first semiconductor, a second bonding pad is provided at a bonding surface of the first semiconductor layer and the second semiconductor pre-processing layer;
• Step 12, grinding a bottom part of the second semiconductor pre-processing layer by a preset thickness to obtain a second semiconductor layer;
• Step 13, performing etching on the second semiconductor layer to form a groove in a third region, wherein a depth of the groove is equal to that of the second semiconductor layer;
• and
• Step 14, forming a metal connection layer on a surface of the groove by metal evaporation, wherein a portion where the metal connection layer extends to the bottom of the second semiconductor layer serves as the metal connection area;
• Step S2, fixing the acoustic transducer to the first region of the substrate, fixing the integrated circuit chip to the second region of the substrate, connecting the integrated circuit chip to the second region of the substrate through the metal connection area of the bottom of the integrated circuit chip;
• Step S3, setting lead wires to connect an electric connection point of the acoustic transducer to the first bonding pad of the integrated circuit chip;
• and
• Step S4, arranging a cover on the substrate to form an acoustic cavity with the substrate.