Packaging for a MEMS transducer
AssigneeCirrus Logic, Inc.
InventorsRoberto Brioschi, Rkia Achehboune
Life of this patent
Estimating the term…
Abstract
The present application describes a MEMS transducer package having a substrate layer which defines a recess. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate.
Claims17
A MEMS transducer package comprising:
- a package substrate comprising a cavity which is formed through the package substrate from an upper surface to a lower surface thereof;
- a substrate layer which underlies the package substrate, wherein a boundary edge of the substrate layer defines a recess which extends in the plane of the substrate layer and wherein the cavity overlies the recess;
- and
- a base substrate which underlies the package substrate, the substrate layer being provided on the base substrate, wherein the base substrate comprises an aperture which extends from an upper surface of the base substrate to the lower surface of the base substrate and wherein an integrated circuitry chip is provided within the aperture.
A base substrate comprising a substrate layer formed on an upper surface of the base substrate, a boundary edge of the substrate layer defining a recess which extends in the plane of the substrate layer, wherein the base substrate further comprises an aperture which extends from an upper surface of the base substrate to the lower surface of the base substrate, and wherein a circuitry chip is provided within the aperture.
Dependencies are inferred from the claim text.