Sensor system, sensor arrangement, and assembly method using solder for sealing

A method of assembling a sensor system, the method comprising the steps of:

• providing at least one transducer element, which is operable to monitor at least one measurand and to generate an electrical output signal correlated with the at least one measurand, wherein
• (a) the transducer element forms a sensor substrate, or
• (b) wherein the transducer element is mounted on a first surface of a sensor substrate, which has at least one first opening through which the measurand has access to the transducer element;
• providing a circuit carrier for mounting the sensor substrate, the circuit carrier having a contact pad, at least one second opening, and an electrically conductive solderable first sealing pattern which surrounds the at least one second opening at least partly, the first sealing pattern is a reflow solder material;
• aligning the circuit carrier with the sensor substrate in a way that access of the at least one measurand to the transducer element is allowed through a media channel penetrating the circuit carrier and being formed of at least the second opening, and that the electrically conductive solderable first sealing pattern is aligned with a solderable second sealing pattern arranged on the sensor substrate and the contact pad is aligned with a terminal arranged on the sensor substrate;
• performing a soldering step so that a soldered sealing connection comprising only solderable material of each of the first sealing pattern and the second sealing pattern, which at least partly surrounds the media channel, is formed between only the first sealing pattern and the second sealing pattern, the entirety of the soldered sealing connection is positioned closer to the media channel than the contact pad and the terminal and seals the media channel from the contact pad and the terminal.