Method for manufacturing camera modules and a camera module array
AssigneeRobert Bosch GmbH
InventorsAdrian Severin Matusek, Andreas Kugler, Stefan Apelt, Ulrich Schaaf
Life of this patent
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Abstract
A method for manufacturing a camera module array, made up of at least two camera modules, each camera module including a circuit carrier, an image sensor and at least one optical element, including: mounting the image sensor on the circuit carriers; applying a protective layer to the circuit carriers, the image sensors not being covered by the protective layer or being left exposed; and mounting the optical elements on the image sensors with the aid of an injection molding process and/or embossing process.
Claims23
A method for manufacturing a camera module array, the method comprising:
- mounting image sensors on circuit carriers, wherein the camera module array includes at least two camera modules, each of the at least two camera modules including a respective one of the circuit carriers and a respective one of the image sensors;
- forming a protective layer by performing a local pressure molding process in which a molding compound is added to a separating foil and is subsequently pressed locally onto the circuit carriers and/or onto components mounted on the circuit carriers, wherein at least a portion of each of the image sensors is not covered by the formed protective layer;
- and
- mounting on each of the image sensors at least one respective optical element using an injection molding process and/or embossing process.
A method for manufacturing a camera module, the method comprising:
- manufacturing a camera module array, by performing the following:
- mounting image sensors on circuit carriers, wherein the camera module array includes at least two camera modules, each of the at least two camera modules including a respective one of the circuit carriers and a respective one of the image sensors;
- forming a protective layer by performing a local pressure molding process in which a molding compound is added to a separating foil and is subsequently pressed locally onto the circuit carriers and/or onto components mounted on the circuit carriers, wherein at least a portion of each of the image sensors is not covered by the formed protective layer;
- and
- mounting on each of the image sensors at least one respective optical element using an injection molding process and/or embossing process;
- and
- separating the at least two camera modules.
Dependencies are inferred from the claim text.