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US 11,146,711 B1Granted
Heatsinks for an image capture device
AssigneeGoPro, Inc.
InventorsKielan C. Crow, Nicholas Vitale, Eduardo Hernandez Pacheco
Life of this patent
Estimating the term…
Abstract
An image capture device includes a first component that is configured to provide thermal energy. A heatsink is spaced a distance apart from the first component, and a second component is positioned between the first component and the heatsink. A conductor contacts the first component and the heatsink, and the conductor extends from the first component along sides of the second component to the heatsink.
Claims20
An image capture device, comprising:
- a first component configured to provide thermal energy;
- a heatsink spaced a distance apart from the first component;
- a second component positioned between the first component and the heatsink;
- and
- a conductor that contacts the first component and the heatsink, wherein the conductor extends from the first component along a first side and a second side of the second component to the heatsink, and wherein the first side and the second side are substantially perpendicular.
2 more elements
An image capture device, comprising:
- a heatsink;
- a printed circuit board configured to provide thermal energy;
- first and second components separating the printed circuit board and the heatsink;
- and
- a conductor that facilitates management of thermal energy, the conductor connecting the printed circuit board and the heatsink by extending along sides of the first component and between the first component and the second component.
2 more elements
An image capture device, comprising:
- a first heatsink;
- a second heatsink;
- a printed circuit board configured to provide thermal energy, the printed circuit board positioned between the first heatsink and the second heatsink;
- a component separating the first heatsink and the printed circuit board;
- and
- a conductor that facilitates movement of thermal energy, the conductor extending along sides of the component and connecting the printed circuit board, the first heatsink, and the second heatsink.
3 more elements
Dependencies are inferred from the claim text.