IO-link device

An TO-link device configured as slave for transmitting or receiving signal data with a master module, the TO-link device comprising:

• a sensor or actuator configured to output measurement signals;
• a first microcontroller operatively coupled to the sensor or actuator and configured to receive the measurement signals and to generate data based on the measurement signals, and
• a transceiving module comprising a physical layer transceiver configured to receive or transmit signal data from or to the master module, wherein the transceiving module is implemented with an integrated circuit in a single chip,
• the device comprising a second microcontroller operatively coupled to, and in bidirectional communication with, the physical layer transceiver,
• wherein the physical layer transceiver is configured to receive signal data associated with a request from the master module and to transmit signal data associated with the request to the second microcontroller;
• the second microcontroller is configured to receive the signal data from the physical layer transceiver and to execute a device IO-Link protocol stack, the second microcontroller being operatively coupled to, and in bidirectional communication with, the first microcontroller for the transmission of the signal data associated with the request to the first microcontroller and for the reception of data based on the measurement signals from the first microcontroller in response to the signal data associated with the request.

An TO-link device configured as slave for transmitting or receiving signal data with a master module, the TO-link device comprising:

• a sensor or actuator configured to output measurement signals;
• a first microcontroller operatively coupled to the sensor or actuator and configured to receive the measurement signals and to generate data based on the measurement signals, and
• a transceiving module comprising a physical layer transceiver configured to receive or transmit signal data from or to the master module,
• the device comprising a second microcontroller operatively coupled to, and in bidirectional communication with, the physical layer transceiver,
• wherein the second microcontroller and the physical layer transceiver are implemented with an integrated circuit in a single chip,
• wherein the physical layer transceiver is configured to receive signal data associated with a request from the master module and to transmit signal data associated with the request to the second microcontroller;
• the second microcontroller is configured to receive the signal data from the physical layer transceiver and to execute a device TO-Link protocol stack, the second microcontroller being operatively coupled to, and in bidirectional communication with, the first microcontroller for the transmission of the signal data associated with the request to the first microcontroller and for the reception of data based on the measurement signals from the first microcontroller in response to the signal data associated with the request.