Film bulk acoustic resonator having suppressed lateral mode

A packaged module comprising:

• a packaging substrate configured to receive a plurality of components;
• and
• a film bulk acoustic resonator device implemented on the packaging substrate, the film bulk acoustic resonator device including a substrate, and first and second electrodes implemented over the substrate, the film bulk acoustic resonator device further including a piezoelectric layer implemented between the first and second electrodes that are configured to provide a resonator shape defined by an outline of an overlap of the first and second electrodes, the resonator shape including N smooth curves joined by N vertices of an N-sided polygon having an inside, each vertex joining two neighboring smooth curves such that the two neighboring smooth curves combined is not a smooth curve due to the respective vertex, each smooth curve having a concave shape with respect to the inside of the N-sided polygon, the resonator shape configured to have no axis of symmetry.