Surface treated copper foil

A laminate comprising,

• a resin layer, and
• a surface-treated copper foil comprising,
• an electrodeposited copper foil including a drum side and a deposited side,
• a treatment layer disposed on the drum side providing a surface-treated side in contact with the resin layer, and wherein the treatment layer comprises a nodule layer,
• wherein the surface-treated side exhibits a void volume (Vv) in a range of 0.4 to 2.2 μm3/μm2, an arithmetic mean waviness (Wa) in a range of 0.1 to 0.4 μm, a core void volume (Vvc) in a range of 0.4 to 2 μm3/μm2, and a dale void volume (Vvv) in a range of 0.01 to 0.1 μm3/μm2, and a surface reflectance at 700 nm in a range of 40% to 70%.

A surface-treated copper foil comprising:

• an electrodeposited copper foil including a drum side and a deposited side, and
• a treatment layer disposed on the drum side providing a surface-treated side,
• wherein the treatment layer comprises a nodule layer and wherein the surface-treated side exhibits a void volume (Vv) in a range of 0.4 to 2.2 μm3/μm2 and an arithmetic mean waviness (Wa) lower than or equal to 0.4 μm,
• wherein the nodule layer comprises copper nodules, and the treatment layer further comprises at least one of a barrier layer, an anti-tarnish layer, and a coupling layer.