Input device and manufacturing method thereof
AssigneesInterface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution Limited
InventorYu-Chieh Tu
Life of this patent
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Abstract
An input device includes a substrate structure, a conductive adhesive layer, and a piezoelectric structure. The conductive adhesive layer is disposed over the substrate structure. The conductive adhesive layer includes an adhesive portion and a plurality of metal particles, and the plurality of metal particles are substantially aligned in a first direction. The piezoelectric structure is disposed over the conductive adhesive layer. The piezoelectric structure extends in a second direction that is perpendicular to the first direction.
Claims18
An input device, comprising:
- a substrate structure comprising a substrate and a first electrode layer disposed over the substrate;
- a conductive adhesive layer disposed on the substrate structure, wherein the conductive adhesive layer includes an adhesive portion and a plurality of metal particles, and the plurality of metal particles are aligned substantially in a first direction;
- and
- a piezoelectric structure disposed on the conductive adhesive layer, wherein the piezoelectric structure extends along a second direction perpendicular to the first direction, the piezoelectric structure comprises a piezoelectric material layer and a second electrode layer disposed under the piezoelectric material layer, and the conductive adhesive layer is disposed between the first electrode layer and the second electrode layer, and the first electrode layer and the second electrode layer are configured to electrically connect to each other by the plurality of metal particles.
A method for manufacturing an input device, comprising:
- (i) providing a substrate structure, wherein the substrate structure comprises a substrate and a first electrode layer disposed over the substrate;
- (ii) dispensing an adhesive and a plurality of metal particles over the substrate structure, wherein the plurality of metal particles are dispersed in the adhesive;
- (iii) disposing a piezoelectric structure over the plurality of metal particles, wherein the piezoelectric structure extends along a first direction, the piezoelectric structure comprises a piezoelectric material layer and a second electrode layer disposed under the piezoelectric material layer, and the conductive adhesive layer is disposed between the first electrode layer and the second electrode layer;
- (iv) aligning the plurality of metal particles along substantially a second direction perpendicular to the first direction, wherein the first electrode layer and the second electrode layer are configured to electrically connect to each other by the plurality of metal particles;
- and
- (v) curing the adhesive.
Dependencies are inferred from the claim text.