Adhesion layer to enhance encapsulation of superconducting devices
AssigneeInternational Business Machines Corporation
InventorsRichard Alan Haight, Ali Afzali-Ardakani, Vivekananda P. Adiga, Martin O. Sandberg, Hanhee Paik
Life of this patent
Estimating the term…
Abstract
Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing an adhesion layer onto a superconducting resonator and a silicon substrate that are comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the adhesion layer can comprise a chemical compound having a thiol functional group.
Claims25
A method, comprising:
- depositing an adhesion layer onto a superconducting resonator and a silicon substrate that are comprised within a quantum processor, wherein the superconducting resonator is positioned on the silicon substrate, and wherein the adhesion layer comprises a chemical compound having a thiol functional group.
A method, comprising:
- depositing a chemical compound having a thiol functional group onto a surface of a silicon substrate and a surface of a superconducting resonator, wherein the surface of the silicon substrate and the surface of the superconducting resonator are oxide-free.
A method, comprising:
- preparing a surface of a quantum processor for adhesion with a metal fluoride coating by depositing a chemical compound having a thiol functional group onto a silicon substrate and a superconducting resonator of the quantum processor.
An apparatus, comprising:
- an adhesion layer positioned on a superconducting resonator that is located on a surface of a silicon substrate, wherein the superconducting resonator and the silicon substrate are comprised within a quantum processor, and wherein the adhesion layer comprises a chemical compound having a thiol functional group.
An apparatus, comprising:
- an adhesion layer positioned between a superconducting resonator and a metal fluoride layer, wherein the superconducting resonator is positioned on a silicon substrate within a quantum processor.
Dependencies are inferred from the claim text.