US 11,145,797 B1 · Forming conformable layer with flap on semiconductor devices

Abstract

Embodiments relate to forming an elastomeric interface layer (elayer) with a flap over multiple light emitting diode (LED) dies by forming materials across multiple LED dies and removing the materials between the LED dies. The formed flap of the elayer provides a large surface area for adhesion between each LED and a pick-up surface. For example, the flap may have a surface area that is larger than the light emitting surface of the LED die, or larger than the surface area of an elastomeric interface layer without the flap. As such, the elayer allows each LED to be picked up by a pick-up surface and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (μLED) dies.

Claims20

Dependent claims

A method comprising:

forming a frame along a side surface of a light emitting diode (LED) die on a carrier substrate, the frame extending partially above a light emitting surface of the LED die, the frame and the light emitting surface of the LED die defining a recessed region;
depositing a conformable material on the LED die including in the recessed region to form a body portion of the conformable material, and over the recessed region and over the frame to form a top portion of the conformable material over the body portion;
removing parts of the top portion of the conformable material to form a conformable flap, wherein at least a portion of a bottom surface of the conformable flap is over the frame;
and
removing the frame to form a conformable interface layer of the LED die comprising the body portion and the conformable flap on the body portion.

2 more elements

A display manufacturing system comprising:

one or more processors;
and
a computer-readable readable medium storing instructions that when executed by the one or more processors cause the one or more processors to:
form a frame along a side surface of a light emitting diode (LED) die on a carrier substrate, the frame extending above a light emitting surface of the LED die, the frame and the light emitting surface of the LED die defining a recessed region;
deposit a conformable material on the LED die including in the recessed region to form a body portion of the conformable material, and over the recessed region and over the frame to form a top portion of the conformable material over the body portion;
remove parts of the top portion of the conformable material to form a conformable flap;
and
remove the frame to form a conformable interface layer of the LED die comprising the body portion and the conformable flap on the body portion.

5 more elements

Dependencies are inferred from the claim text.

Forming conformable layer with flap on semiconductor devices

Life of this patent

Forming conformable layer with flap on semiconductor devices

Life of this patent

Abstract

Claims20