Light emitting apparatus and method for manufacturing same

A method for manufacturing a light-emitting apparatus comprising the steps of:

• mounting an LED device on the upper surface of a package substrate, and electrically connecting the LED device to the electrode part electrodes of the package substrate;
• forming a resin frame enclosing the LED device on the upper surface of the package substrate;
• filling a sealing resin into a region on the package substrate enclosed by the resin frame to seal the LED device, thereby manufacturing an LED package including the package substrate, the LED device, the resin frame and the sealing resin;
• inserting the LED package into an opening of a circuit board from the back side of the circuit board, and electrically connecting the electrodes of the package substrate to the back side of the circuit board, while disposing a heat sinking substrate on the back side of the circuit board so that the back surface of the package substrate is in contact with the heat sinking substrate;
• forming a reinforcing resin on the upper surface of the circuit board around the opening, so as to enclose an outer portion of the resin frame;
• and
• forming a lens resin on the resin frame, the sealing resin and the reinforcing resin, the lens resin condensing light emitted from the LED device through the sealing resin, wherein
• the reinforcing resin is harder than the lens resin.