Chip scale light emitting device package with dome

A method, comprising:

• forming a wafer of a plurality of light emitting devices on a first substrate, each of the plurality of light emitting devices separated from each other by a space;
• disposing a metal pad layer on the plurality of light emitting devices, such that the metal pad layer includes a space that forms a first metal pad and a second metal pad within each light emitting device;
• disposing, on the wafer of plurality of light emitting devices, one or more metal base layers;
• disposing a removable material on the one or more metal base layers coincident to the spaces between the plurality of light emitting devices and coincident to the space between the first metal pad and the second metal pad of each light emitting device;
• disposing a metal layer over the one or more metal base layers between the removable material;
• removing the removable material;
• disposing an electrically insulating material in spaces where the removable material was removed;
• and
• removing the first substrate.