System and method for light emitting diode (LED) display repair

A method for repairing an emissive element display, the method comprising:

• providing a substrate with a matrix of emissive element control lines;
• forming an array of emissive element subpixels, with emissive element contacts and laser fusible repair nodes, each repair node electrically connected between an emissive element first contact and a first control line of the matrix;
• prior to populating the subpixels with emissive elements, forming a dielectric layer overlying a top surface of the substrate;
• forming wells in the dielectric layer, each well configured to accept an emissive element;
• forming access openings in the dielectric layer exposing each repair node;
• populating the subpixels with emissive elements;
• detecting a defective emissive element associated with a first repair node in a first subpixel;
• laser fusing the first subpixel first repair node to isolate the defective emissive element;
• and,
• wherein forming the array of emissive element subpixels with repair nodes includes forming subpixels with contacts for parallel emissive elements.

A display with emissive element repair interfaces, the display comprising:

• a substrate with a top surface;
• a matrix of electrically conductive control lines;
• an array of emissive element pixels, each pixel comprising a plurality of subpixels;
• each subpixel configured to accept n number of parallel emissive elements, n number of parallel repair nodes, and n number of parallel emissive element first contacts, with each subpixel selectively engageable in response to signals on the control lines;
• and,
• a selectively isolating laser fusible repair node associated with each subpixel, each repair node consisting of an electrically conductive pad, a parallel first pad interface exclusively connected a corresponding emissive element first contact, and a second pad interface electrically connected to a first control line of the matrix.

A method for repairing an emissive element display, the method comprising:

• providing a substrate with a matrix of emissive element control lines;
• forming an array of emissive element subpixels, with emissive element contacts and laser fusible repair nodes, each repair node electrically connected between an emissive element first contact and a first control line of the matrix;
• populating the subpixels with emissive elements;
• detecting a defective emissive element associated with a first repair node in a first subpixel;
• laser fusing the first subpixel first repair node to isolate the defective emissive element;
• wherein forming the array of emissive element subpixels with repair nodes includes forming subpixels with contacts for parallel emissive elements;
• wherein forming subpixels with contacts for parallel emissive elements includes electrically connecting a second contact of each emissive element to a second control line of the matrix;
• wherein detecting the defective emissive element in the first subpixel includes detecting a low impedance defective emissive element, where a low impedance emissive element is an element creating an electrical short;
• and,
• wherein laser fusing the first repair node includes laser fusing to fuse open an electrical connection between the defective emissive element first contact and the first control line of the matrix.

A method for repairing an emissive element display, the method comprising:

• providing a substrate with a matrix of emissive element control lines;
• forming an array of emissive element subpixels, with emissive element contacts and laser fusible repair nodes, each repair node electrically connected between an emissive element first contact and a first control line of the matrix;
• populating the subpixels with emissive elements;
• detecting a defective emissive element associated with a first repair node in a first subpixel;
• laser fusing the first subpixel first repair node to isolate the defective emissive element;
• wherein forming the array of emissive element subpixels with repair nodes includes forming subpixels with contacts for parallel emissive elements:
• with each parallel repair node first pad interface formed on the substrate top surface electrically connected to a first contact of a corresponding parallel emissive element formed on the substrate surface;
• and,
• with parallel emissive element second contacts formed on the substrate top surface, respectively associated with the parallel emissive element first contacts, and electrically connected to a second control line of the matrix.