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US 11,145,782 B2Granted
Processing an optical device
AssigneeTexas Instruments Incorporated
InventorsJane Qian Liu, Gary Philip Thomson
Life of this patent
Estimating the term…
Abstract
A method for processing an integrated optical circuit chip includes securing a panel dam around a periphery of an array of integrated optical circuit chips that share a substrate. The method also includes filling an area circumscribed by the panel dam with an insulating polymer to a level below a top surface of the integrated optical circuit chips. The method further includes singulating a given integrated optical circuit chip in the array of integrated optical circuit chips.
Claims20
A method for manufacturing a device, the method comprising:
- securing a panel dam around a periphery of an array of integrated optical circuits, the array of integrated optical circuits on a substrate;
- filling an area circumscribed by the panel dam with an insulating polymer to a level below a surface of the integrated optical circuits;
- etching the insulating polymer, to expose at least a portion of the substrate;
- and
- forming scribe lines in the at least a portion of the substrate.
2 more elements
A method for manufacturing a device, the method comprising:
- securing a panel dam on a substrate around a periphery of an array of integrated optical circuits, wherein the integrated optical circuits comprise aperture windows;
- filling an area circumscribed by the panel dam with an insulating polymer to a level below a top edge of the aperture windows, the insulating polymer on four sides of the aperture windows, exposing top surfaces of the aperture windows;
- and
- singulating an integrated optical circuit of the array of integrated optical circuits.
1 more element
Dependencies are inferred from the claim text.