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US 11,145,777 B2Granted
Optical sensor module, method for manufacturing the same and frame structure thereof
AssigneesLite-On Opto Technology (Changzhou) Co., Ltd., Lite-On Technology Corporation
InventorsChen-Hsiu Lin, Shih-Chung Huang, Bo-Jhih Chen
Life of this patent
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Abstract
An optical sensor module includes a first frame set, a second frame set and a housing which partially covers the first frame set and the second frame set. The first frame set has a first chip-mounting frame and a first wiring frame. The first chip-mounting frame has a first chip-mounting section, and a first conductive lead. At least one first indentation is formed on the first chip-mounting section. The second frame set has a second chip-mounting frame and a second wiring frame. The second chip-mounting frame has a second chip-mounting section and a second conductive lead. At least one second indentation is formed on the second chip-mounting section.
Claims17
A frame structure of an optical sensor module, comprising:
- a first frame set including a first chip-mounting frame and a first wiring frame, wherein the first chip-mounting frame has a first chip-mounting section, and a first conductive lead extending from the first chip-mounting section along a longitudinal direction, wherein the first wiring frame has a first wiring section, and a first transmitting lead extending from the first wiring section along the longitudinal direction;
- and
- a second frame set including a second chip-mounting frame and a second wiring frame, wherein the second chip-mounting frame has a second chip-mounting section, and a second conductive lead extending from the second chip-mounting section along the longitudinal direction, wherein the second wiring frame has a second wiring section, and a second transmitting lead extending from the second wiring section along the longitudinal direction;
- wherein the first wiring frame has a first protrusion partially protruding from the first wiring section toward the second wiring frame perpendicular to the longitudinal direction, and the second wiring frame has a second protrusion partially protruding from the second wiring section toward the first wiring frame perpendicular to the longitudinal direction;
- wherein a corner of the first chip-mounting section adjacent to the first protrusion forms a first arc notch, and a corner of the second chip-mounting section adjacent to the second protrusion forms a second arc notch, so as to form an opening cooperatively defined by the first protrusion, the second protrusion, the first arc notch and the second arc notch.
2 more elements
An optical sensor module, comprising:
- a frame structure, including:
- a first frame set including a first chip-mounting frame and a first wiring frame, wherein the first chip-mounting frame has a first chip-mounting section, and the first wiring frame has a first wiring section;
- and
- a second frame set including a second chip-mounting frame and a second wiring frame, wherein the second chip-mounting frame has a second chip-mounting section, and the second wiring frame has a second wiring section;
- a light source element disposed on the first chip-mounting section of the first chip-mounting frame;
- a light detector disposed on the second chip-mounting section of the second chip-mounting frame;
- and
- a housing defining a first transparent window and a second transparent window, wherein the first transparent window is corresponding to the light source element and the second transparent window is corresponding to the light detector;
- wherein the housing defines a first compartment, a second compartment and a partition wall between the first compartment and the second compartment;
- the light source element is located in the first compartment, and the light detector is located in the second compartment;
- wherein a width of a top portion of the partition wall is smaller than a width of a root portion of the partition wall.
8 more elements
A method of manufacturing an optical sensor module, comprising steps as follows:
- a stamping step, stamping a metal sheet to form a joint frame, a first frame set, and a second frame set;
- wherein the first frame set includes a first chip-mounting frame and a first wiring frame, and the second frame set includes a second chip-mounting frame and a second wiring frame;
- wherein the joint frame forms a plurality of retaining tabs extending inward;
- an injection molding step, injecting an insulated material to form a housing, and the housing partially covering the first frame set and the second frame set to form a first compartment, a second compartment and a partition wall located between the first compartment and the second compartment, wherein the housing covers the retaining tabs, and the retaining tabs insert into sides of the housing;
- a trimming and forming step, separating the first frame set and the second frame set away from the joint frame;
- a bonding and wiring step, disposing a light source element on the first chip-mounting frame of the first frame set, disposing a light detector on the second chip-mounting frame of the second frame set, and wiring to connect the light source element to the first wiring frame, and connecting the light detector to the second wiring frame;
- an encapsulating step, filling a first encapsulating material in the first compartment, and filling a second encapsulating material in the second compartment;
- and
- a separating step, pushing the housing away from the retaining tab of the joint frame.
6 more elements
Dependencies are inferred from the claim text.