Semiconductor device and method of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang
Estimating the term…
A method includes forming a gate structure over a fin protruding above a substrate, forming a gate spacer layer on sidewalls of the gate structure, forming an etch stop layer on sidewalls of the gate spacer layer, replacing the gate structure with a gate stack, forming a source/drain contact adjacent the etch stop layer, recessing the gate stack to form a first recess, filling the first recess with a first dielectric material, recessing the source/drain contact and the etch stop layer to form a second recess, filling the second recess with a second dielectric material, recessing the second dielectric material and the gate spacer layer to form a third recess, and filling the third recess with a third dielectric material, wherein the composition of the third dielectric material is different from that of the first dielectric material and the second dielectric material.
A device, comprising:
A semiconductor device, comprising:
A method, comprising:
Dependencies are inferred from the claim text.