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US 11,145,632 B2Granted
High density die package configuration on system boards
AssigneeIntel Corporation
InventorsJuan E. Dominguez, Hyoung Il Kim, Bilal Khalaf, John Gary Meyers
Life of this patent
Estimating the term…
Abstract
A high density die package configuration is shown for use on system boards. In one example, an apparatus includes a system board, a first package mounted to the system board, a second package mounted to the system board, and an interface package mounted between the first and the second package and coupled directly to the first package and to the second package through the respective first and second packages.
Claims20
An apparatus comprising:
- a system board;
- a first package mounted to the system board;
- a second package mounted to the system board;
- and
- an interface package mounted between the first and the second package and coupled directly to the first package and to the second package.
2 more elements
An apparatus comprising:
- a system board having a socket;
- a first package mounted to the system board;
- a second package mounted to the system board;
- and
- an interface package having a substrate including a connector at an end of the substrate configured to connect to the socket,
- wherein the interface package is mounted to the socket between the first and the second package orthogonal to the system board and coupled to the first and the second package through the system board.
3 more elements
A solid state memory drive comprising:
- a system board having an end connector to attach to a main board, wherein the drive provides memory to the main board;
- interface chips coupled to the end connector;
- a memory array controller to manage higher level functions of the drive and coupled to the interface chips;
- a first memory package mounted to the system board;
- a second memory package mounted to the system board;
- and
- an interface package mounted between the first memory package and the second memory package coupled directly to the first memory package and to the second memory package, the interface package coupled to the memory array controller through the first and second memory packages.
4 more elements
Dependencies are inferred from the claim text.