Semiconductor package

A semiconductor package, comprising:

• a base structure having a lower surface and an upper surface, and having a first pad on the lower surface, and a second pad on the upper surface;
• a first semiconductor chip stacked on the upper surface of the base structure, and having a first connection pad directly bonded to the second pad and a first through-electrode connected to the first connection pad;
• a first bonding structure disposed between the base structure and the first semiconductor chip, the first bonding structure including a base insulation layer on the upper surface of the base structure, and a first lower insulation layer on the first semiconductor chip, the first lower insulation layer directly bonded to the base insulation layer;
• a second semiconductor chip stacked on the first semiconductor chip, and having a second connection pad connected to the first through-electrode;
• a second bonding structure disposed between the first semiconductor chip and the second semiconductor chip, the second bonding structure including a first upper insulation layer directly contacting the first semiconductor chip, a second upper insulation layer directly contacting the first upper insulation layer, and a second lower insulation layer directly contacting the first upper insulation layer and the second semiconductor chip;
• and
• a molding member surrounding the first and second semiconductor chips, wherein:
• the first upper insulation layer and the second upper insulation layer have a dummy insulation portion extending beyond a periphery of the first semiconductor chip,
• the molding member has a first resin portion disposed around the first semiconductor chip on the base structure, and has a second resin portion disposed around the second semiconductor chip on the dummy insulation portion, and
• a lower surface of the first upper insulation layer directly contacts an upper surface of the first resin portion, and an upper surface of the second upper insulation layer directly contacts a lower surface of the second resin portion in the dummy insulation portion;
• wherein a side surface of the dummy insulation portion is flush with side surfaces of the first resin portion and the second resin portion.