Discrete polymer in fan-out packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Jie Chen
Life of this patent
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Abstract
A package includes a first molding material, a lower-level device die in the first molding material, a dielectric layer over the lower-level device die and the first molding material, and a plurality of redistribution lines extending into the first dielectric layer to electrically couple to the lower-level device die. The package further includes an upper-level device die over the dielectric layer, and a second molding material molding the upper-level device die therein. A bottom surface of a portion of the second molding material contacts a top surface of the first molding material.
Claims20
A package comprising:
- a first dielectric layer;
- a first device die overlapping the first dielectric layer;
- and
- a first plurality of redistribution lines extending into the first dielectric layer;
- and
- a first encapsulant encapsulating the first device die therein, wherein a first top surface of the first encapsulant is coplanar with a second top surface of the first device die, and wherein the first encapsulant comprises:
- a first portion overlapping a portion of the first dielectric layer;
- and
- a second portion comprising a first sidewall contacting a second sidewall of the first dielectric layer to form an interface.
A package comprising:
- a first plurality of dielectric layers;
- a plurality of redistribution lines extending into the first plurality of dielectric layers;
- a first device die overlapping the first plurality of dielectric layers;
- a through-via overlapping the first plurality of dielectric layers and electrically coupling to one of the plurality of redistribution lines;
- and
- a first encapsulant, with the first device die and the through-via being in the first encapsulant, wherein the first encapsulant contacts the first device die and the through-via, and the first encapsulant extends laterally beyond edges of the first plurality of dielectric layers.
A package comprising:
- a first encapsulant;
- a first device die encapsulated in the first encapsulant;
- a first dielectric layer over and contacting both of the first device die and the first encapsulant;
- a second encapsulant comprising:
- a first portion overlapping the first dielectric layer;
- and
- a second portion extending to a side of the first dielectric layer, the second portion comprising a bottom surface contacting a top surface of the first encapsulant;
- and
- a second device die encapsulated in the second encapsulant.
Dependencies are inferred from the claim text.