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US 11,145,620 B2Granted
Formation of bonding wire vertical interconnects
AssigneeAsm Technology Singapore Pte Ltd
InventorsMow Huat Goh, Jiang Huang, Ya Ping Zhu, Chi Kwan Park, Keng Yew Song
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Abstract
A wire bonding method, comprising the steps of: extending a length of bonding wire from a capillary to form a wire tail; deforming a point on the wire tail to form a weakened portion between the wire tail and a remainder of the bonding wire retained within the capillary; and retracting at least a portion of the wire tail including the weakened portion into the capillary prior to bonding the wire tail to at least one of a bonding pad and a substrate.
Claims14
A wire bonding method, comprising the steps of:
- extending a length of bonding wire from a capillary to form a wire tail;
- deforming a point on the wire tail to form a weakened portion between an unweakened portion of the wire tail and a remainder of the bonding wire retained within the capillary;
- and
- retracting at least a portion of the wire tail including the weakened portion into the capillary prior to bonding the wire tail to at least one of a bonding pad and a substrate.
1 more element
Dependencies are inferred from the claim text.