Bonding equipment
AssigneeSharp Kabushiki Kaisha
InventorsKatsuji Iguchi, Masumi Maegawa, Keiichi Sawai, Hiroyoshi Higashisaka, Takanobu Matsuo
Life of this patent
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Abstract
Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.
Claims20
Bonding equipment for bonding a chip having a first electrode and a substrate having a second electrode so that the first electrode and the second electrode are electrically connected to each other, the bonding equipment comprising:
- a laminar flow source adapted to generate a laminar flow in which dust is removed;
- a chip handling portion adapted to pick the chip up;
- a cleaning portion adapted to clean the chip;
- a bonding portion which includes a bonding stage adapted to bond the chip and the substrate;
- and
- a transfer mechanism adapted to transfer the chip from the chip handling portion to the bonding portion, wherein at least the cleaning portion and the bonding portion are provided in the laminar flow, and
- the cleaning portion includes a cleaning cup and a door closing an upper portion of the cleaning cup.
Bonding equipment for bonding a chip having a first electrode and a substrate having a second electrode so that the first electrode and the second electrode are electrically connected to each other, the bonding equipment comprising:
- a laminar flow source adapted to generate a laminar flow in which dust is removed;
- a chip handling portion adapted to pick the chip up;
- a cleaning portion adapted to clean the chip;
- a bonding portion which includes a bonding stage adapted to bond the chip and the substrate;
- and
- a transfer mechanism adapted to transfer the chip from the chip handling portion to the bonding portion, wherein
- at least the cleaning portion and the bonding portion are provided in the laminar flow,
- the transfer mechanism includes at least one bonding head adapted to chuck the chip,
- the cleaning portion is provided in a transfer section from the chip handling portion to the bonding portion and the chip is cleaned while being chucked by the bonding head,
- the cleaning portion includes a cleaning cup and a door closing an upper portion of the cleaning cup, and the door holds the bonding head in place.
Bonding equipment for bonding a chip having a first electrode and a substrate having a second electrode so that the first electrode and the second electrode are electrically connected to each other, the bonding equipment comprising:
- a laminar flow source adapted to generate a laminar flow in which dust is removed;
- a chip handling portion adapted to pick the chip up;
- a cleaning portion adapted to clean the chip;
- a bonding portion which includes a bonding stage bonding the chip and the substrate;
- and
- a transfer mechanism transferring the chip from the chip handling portion to the bonding portion, wherein
- at least the cleaning portion and the bonding portion are provided in the laminar flow,
- the transfer mechanism includes at least one bonding head adapted to chuck the chip,
- the cleaning portion is provided in a transfer section from the chip handling portion to the bonding portion and the chip is cleaned while being chucked by the bonding head, and
- the transfer mechanism includes a first transfer hand adapted to hold the bonding head in place and transferring the bonding head.
Bonding equipment for bonding a chip having a first electrode and a substrate having a second electrode so that the first electrode and the second electrode are electrically connected to each other, the bonding equipment comprising:
- a laminar flow source adapted to generate a laminar flow in which dust is removed;
- a chip handling portion adapted to pick the chip up;
- a cleaning portion adapted to clean the chip;
- a bonding portion which includes a bonding stage adapted to bond the chip and the substrate;
- and
- a transfer mechanism adapted to transfer the chip from the chip handling portion to the bonding portion, wherein
- at least the cleaning portion and the bonding portion are provided in the laminar flow, and
- a hold surface adapted to chuck the substrate is provided on the bonding stage and the laminar flow source generates a laminar flow parallel to the hold surface.
Bonding equipment for bonding a chip having a first electrode and a substrate having a second electrode so that the first electrode and the second electrode are electrically connected to each other, the bonding equipment comprising:
- a laminar flow source adapted to generate a laminar flow in which dust is removed;
- a chip handling portion adapted to pick the chip up;
- a cleaning portion adapted to clean the chip;
- a bonding portion which includes a bonding stage adapted to bond the chip and the substrate;
- and
- a transfer mechanism adapted to transfer the chip from the chip handling portion to the bonding portion, wherein
- at least the cleaning portion and the bonding portion are provided in the laminar flow,
- a substrate handling portion, which receives the substrate, supplies the substrate to the bonding portion, and draws the substrate out, is provided in the laminar flow, and
- the substrate handling portion has a method of providing a connection material, for electrically connecting the first electrode and the second electrode, on the substrate.
Dependencies are inferred from the claim text.