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US 11,145,617 B2Granted
Semiconductor structure
AssigneeWinbond Electronics Corp.
InventorYu-Ming Chen
Life of this patent
Estimating the term…
Abstract
A semiconductor structure includes a substrate, a chip, a plurality of conductive bumps, a flexible printed circuit (FPC) board and a plurality of circuit patterns. The chip is disposed on the substrate and includes a plurality of pads. The conductive bumps are disposed on the pads respectively. The FPC board is connected between the substrate and the chip, and the conductive bumps penetrate through an end of the FPC board. The circuit patterns are disposed on the FPC board and electrically connected to the conductive bumps and the substrate.
Claims11
A semiconductor structure, comprising:
- a substrate;
- a first chip disposed on the substrate and comprising a plurality of first pads;
- a plurality of first conductive bumps disposed on the first pads respectively;
- a first flexible printed circuit (FPC) board connecting between the substrate and the first chip, wherein the plurality of first conductive bumps penetrate through a first end of the first FPC board;
- and
- a plurality of first circuit patterns disposed on the first FPC board and extended from the first FPC board onto the substrate for electrically connecting the plurality of first conductive bumps and the substrate.
3 more elements
A semiconductor structure, comprising:
- a substrate;
- a first chip disposed on the substrate and comprising a plurality of first pads;
- a plurality of first conductive bumps disposed on the first pads respectively;
- a first flexible printed circuit (FPC) board connecting between the substrate and the first chip, wherein the plurality of first conductive bumps penetrate through a first end of the first FPC board;
- and
- a plurality of first circuit patterns disposed on the first FPC board and electrically connecting the plurality of first conductive bumps and the substrate;
- a second chip stacked on the first chip without covering the plurality of first conductive bumps;
- a plurality of second conductive bump disposed on a plurality of second pads of the second chip respectively;
- and
- a second FPC board connected between the first chip and the second chip and comprises a plurality of second circuit patterns, wherein the plurality of first conductive bumps and the plurality of second conductive bumps penetrate through two opposite ends of the second FPC board respectively, so as to electrically connect the plurality of first conductive bumps and the plurality of second conductive bumps through the plurality of second circuit patterns.
7 more elements
Dependencies are inferred from the claim text.