Semiconductor device, power conversion apparatus, and method for manufacturing semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsTakumi Shigemoto, Satoru Ishikawa, Yuji Imoto
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Abstract
The semiconductor device includes a semiconductor element substrate having an insulation property, and a wire for positioning the semiconductor element with respect to the semiconductor element substrate. The semiconductor element substrate includes a disposition region for disposing the semiconductor element. The wire is provided at least at a part of the periphery of the disposition region.
Claims9
A semiconductor device in which a semiconductor element is disposed, the semiconductor device comprising:
- a substrate having an insulation property and including a disposition region on which the semiconductor element is disposed via a bonding material in a plan view;
- and
- a wire provided at least at a part of a periphery of the disposition region, wherein
- a part of the wire is present inside the bonding material that bonds the semiconductor element to the substrate.
A method for manufacturing a semiconductor device that includes disposing a semiconductor element on a substrate having an insulation property and including a disposition region on which the semiconductor element is disposed via a bonding material, the method comprising:
- providing a wire at least at a part of a periphery of the disposition region;
- and
- disposing the bonding material and the semiconductor element in the disposition region on which the wire is provided, wherein
- in the providing the wire, the wire is provided so that a part of the wire is present inside the bonding material that bonds the semiconductor element to the substrate.
Dependencies are inferred from the claim text.