Solder material for semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsHirohiko Watanabe, Shunsuke Saito, Yoshitaka Nishimura, Fumihiko Momose
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Abstract
A lead-free solder has a heat resistance temperature which is high and a thermal conductive property which is not changed in a high temperature range. A semiconductor device includes a solder material containing more than 5.0% by mass and 10.0% by mass or less of Sb and 2.0 to 4.0% by mass of Ag, and the remainder consisting of Sn and inevitable impurities. A bonding layer including the solder material, is formed between a semiconductor element and a substrate electrode or a lead frame.
Claims10
A semiconductor device comprising a bonding layer in which a solder material is melted, between a semiconductor element and a substrate electrode or a lead frame,
- wherein the solder material comprises:
- more than 5.0% by mass and equal to or less than 10.0% by mass of Sb;
- 3.0 to 4.0% by mass of Ag;
- 0.01 to 1.0% by mass of Ni;
- and
- the remainder consisting of Sn and inevitable impurities, a thermal conductivity rate of the solder material at 100° C. to 200° C. being not lower than a thermal conductivity rate at 25° C.
Dependencies are inferred from the claim text.