Semiconductor device and method of manufacture

A device, comprising:

• a plurality of semiconductor devices on a carrier substrate, wherein each semiconductor device comprises metal-core solder balls disposed on a side of the semiconductor device opposite the carrier substrate;
• a molding material over the plurality of semiconductor devices, wherein each of the plurality of semiconductor devices is separated by the molding material, wherein the metal-core solder balls of each semiconductor device have planar surfaces that are level with the molding material;
• a redistribution structure over the plurality of semiconductor devices, wherein the redistribution structure is electrically connected to each of the plurality of semiconductor devices, wherein the redistribution structure is electrically connected to the metal-core solder balls of each semiconductor device;
• and
• a plurality of conductive connectors on the redistribution structure, wherein the conductive connectors are electrically connected to the redistribution structure.