Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof

A chip package structure, comprising:

• at least one chip, wherein the respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface;
• at least one thermally conductive element disposed on the back surface of the respective chip;
• a molding compound encapsulating the at least one chip and the at least one thermally conductive element and having an upper surface and a lower surface opposite to each other, wherein a bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound, and the molding compound exposes a top surface of the respective thermal conductive element;
• a redistribution layer disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip;
• at least one conductive through hole penetrating the molding compound and connected to the upper surface and the lower surface of the molding compound;
• at least one first pad disposed on the upper surface of the molding compound and electrically connected to a first end of the respective conductive through hole;
• at least one second pad disposed on the lower surface of the molding compound and electrically connected to a second end of the respective conductive through hole, wherein the redistribution layer is electrically connected to the at least one second pad;
• and
• an antenna structure layer disposed on the upper surface of the molding compound and comprising a dielectric layer and a plurality of antenna patterns, wherein the dielectric layer has at least one opening exposing the at least one thermally conductive element, the dielectric layer covers the upper surface of the molding compound and the at least one first pad, the antenna patterns are embedded in the dielectric layer and aligned with a surface of the dielectric layer that is relatively far from the molding compound, and the antenna patterns are electrically connected to the at least one first pad.