Doherty amplifier with surface-mount packaged carrier and peaking amplifiers

A Doherty amplifier comprising:

• a module substrate having a top substrate surface;
• a first surface-mount device coupled to the top substrate surface, wherein the first surface-mount device includes a first amplifier die;
• a second surface-mount device coupled to the top substrate surface, wherein the second surface-mount device includes a second amplifier die;
• and
• an impedance inverter line assembly electrically connected between outputs of the first and second amplifier dies, wherein the impedance inverter line assembly includes
• an impedance inverter line coupled to the module substrate, wherein the impedance inverter line has a proximal end and a distal end,
• a first lead of the first surface-mount device with a proximal end electrically coupled to an output of the first amplifier die, and a distal end coupled to the proximal end of the impedance inverter line, and
• a second lead of the second surface-mount device with a proximal end electrically coupled to an output of the second amplifier die, and a distal end coupled to the distal end of the impedance inverter line, and
• wherein a first electrical length between the proximal and distal ends of the first lead is in a range from 2 degrees to 16 degrees, a second electrical length between the proximal and distal ends of the impedance inverter line is in a range from 10 degrees to 80 degrees, a third electrical length between the proximal and distal ends of the second lead is in a range from 2 degrees to 16 degrees, and a total electrical length between the outputs of the first and second amplifier dies includes the first, second, and third electrical lengths, and the total electrical length is 90 degrees at a fundamental frequency of operation of the Doherty amplifier.

A Doherty amplifier comprising:

• a module substrate having a top substrate surface;
• an impedance inverter line coupled to the module substrate, wherein the impedance inverter line has a proximal end and a distal end, and the impedance inverter line is characterized by a first electrical length between the proximal and distal ends of the impedance inverter line;
• a first surface-mount device coupled to the top substrate surface, wherein the first surface-mount device includes a first package body that is distinct from the module substrate, a first vertical lead, and a first amplifier die coupled to the first package body, wherein the first vertical lead has a proximal end internal to the first package body, and a distal end external to the first package body, wherein the proximal end of the first vertical lead is above a bottom surface of the first surface-mount device, wherein the first vertical lead is characterized by a second electrical length between the proximal and distal ends of the first vertical lead, wherein the proximal end of the first vertical lead is electrically coupled to an output terminal of a first power transistor integrally formed with the first amplifier die, and wherein the distal end of the first vertical lead is coupled to the proximal end of the impedance inverter line;
• and
• a second surface-mount device coupled to the top substrate surface, wherein the second surface-mount device includes a second package body that is distinct from the first package body and from the module substrate, a second vertical lead, and a second amplifier die coupled to the second package body, wherein the second vertical lead has a proximal end internal to the second package body, and a distal end external to the second package body, wherein the proximal end of the second vertical lead is above a bottom surface of the second surface-mount device, wherein the second vertical lead is characterized by a third electrical length between the proximal and distal ends of the second vertical lead, wherein the proximal end of the second vertical lead is electrically coupled to an output terminal of a second power transistor integrally formed with the second amplifier die, and wherein the distal end of the second vertical lead is coupled to the distal end of the impedance inverter line.