Semiconductor chip

A semiconductor chip comprising:

• a compound semiconductor substrate having first and second main surfaces and a side surface between the first and second main surfaces;
• a circuit on the first main surface;
• a plurality of first metals on the first main surface, the plurality of first metals being positioned, in plan view of the first main surface, closer to an outer edge of the first main surface than the circuit, substantially in a ring shape to surround the circuit with gaps between first metals that are adjacent to each other;
• and
• a plurality of second metals on the first main surface, the plurality of second metals being positioned, in plan view of the first main surface, between the circuit and the plurality of first metals or closer to the outer edge than the plurality of first metals, and the plurality of second metals being positioned, in plan view of the side surface of the compound semiconductor substrate, such that at least a part of each of the second metals overlaps a respective one of the gaps between the first metals.