Semiconductor memory device and method of manufacturing the same
AssigneeKioxia Corporation
InventorHiroyuki Ode
Life of this patent
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AssigneeKioxia Corporation
InventorHiroyuki Ode
Estimating the term…
According to one embodiment, a semiconductor memory device includes: a substrate including a first area, a second area, and a third area, the second and the third areas being adjacent to the first area; a first insulating layer disposed in the first to the third areas; a first wiring disposed on a surface of the first insulating layer in the first area; a first memory cell disposed on the first wiring; a second wiring disposed on the first memory cell; and a contact connected to the second wiring in the second area. The surface of the first insulating layer includes: first surfaces disposed in at least one of the second area and the third area and arranged in the first direction; and second surfaces disposed between the first surfaces. The second surfaces are close to or far from the substrate compared with the first surfaces.
A semiconductor memory device comprising:
Dependencies are inferred from the claim text.